As smartphone performance targets continue to rise, engineers are exploring more advanced cooling solutions, including active cooling. Infinix has been testing its own system, known as CoolMax.
Integrated into a concept gaming phone, CoolMax offers a glimpse of what’s to come. Infinix claims that CoolMax can decrease the chipset’s temperature by 10°C (50°F).
The chipset in question is MediaTek’s Dimensity 9300 with four Cortex-X4 cores, a departure from the usual single core setup. With the assistance of CoolMax and an AI management system, Infinix achieved a record-breaking AnTuTu score of 2,215,639 with the concept device.
So, what exactly is CoolMax? It combines a thermo-electric cooler (Peltier module) with a cooling fan. While similar add-on coolers use the phone’s rear panel between the chipset and cooler, CoolMax is an integrated solution with only thermal paste separating the chipset and cooler.
While Red Magic is known for its gaming phones with active cooling, their setup differs from CoolMax. Red Magic employs a fan to push air through a copper duct, akin to a PC cooler and fan.
The thermo-electric cooler has the potential to reduce temperatures more effectively than pure air cooling by utilizing the Peltier effect to create a temperature differential.
In addition to the Dimensity 9300’s powerful cores, an AI algorithm dynamically allocates tasks to optimize performance. The concept gaming phone also boasts a Pixelworks visual processor and Immortalis-G720 GPU for enhanced visual processing.
Infinix is working on a gaming phone slated for release later in 2024, with details on the device’s proximity to the concept phone currently undisclosed.
At MWC, Infinix also showcased AirCharge, a wireless charging system with a range of up to 20cm, and the Extreme-Temp battery, capable of operating in extreme low temperatures down to -40°C.
This technology offers increased battery endurance, particularly in freezing temperatures where Lithium batteries typically experience reduced performance.
