The all-new vivo X Fold3 Pro is the latest sleek foldable device to hit the market in China, with rumors suggesting it may soon be available in other countries. Curious about how vivo achieved its remarkably slim and lightweight design? Check out the informative teardown video from WekiHome.
The teardown procedure starts with powering off the device and removing the impressively thin SIM card slot of the X Fold3 Pro. By applying heat and some gentle force, the back cover, made of reinforced fiber composite material, is carefully removed. The cover screen is then lifted to reveal the interior components.
Inside, a large copper foil sheet helps with heat dissipation, accompanied by a second-gen Qualcomm ultrasonic fingerprint scanner. The motherboard showcases a dual-stacked design housing three camera sensors, held in place by a unique plastic cover that also contains the flash cable, microphone, ambient light sensor, and laser focus module. Close-up shots of the camera sensors and sample photos are provided.
The teardown progresses to reveal the Snapdragon 8 Gen 3 chip, Samsung LPDDR5X RAM, UFS 4.0 storage modules, and the vivo V3 imaging chip on the motherboard. A copper vapor chamber underneath the board helps regulate temperatures. The video also zooms in on the speakers, microphones, vibration motor, and the dual-cell 5,700mAh silicone anode battery divided into two 2,850mAh cells.
Interestingly, the newer X Fold3 Pro features a smaller VC vapor chamber compared to its predecessor. The teardown wraps up by showcasing the lightweight carbon fiber hinge, weighing just under 15 grams.
