Micron, the dominant American manufacturer of memory chips, unveiled its latest innovation at the MWC 2024. This new solution is touted as the most compact UFS 4.0 package to date, measuring just 9 x 13 millimeters. Despite its small size, it offers up to 1 TB capacity and impressive performance – with sequential read speeds of 4300 MB/s and sequential write speeds of 4000 MB/s.
The decision to create a smaller solution was influenced by feedback from smartphone manufacturers, who expressed a need for more space to accommodate larger batteries. Micron developed this product in collaboration with its partners in customer labs located in the United States, China, and Korea, utilizing its advanced 232-layer 3D NAND technology.
Compared to the 11 x 13 mm solution launched last June, the footprint of the UFS 4.0 chip has been reduced by 20%. This decrease in size will lead to lower power consumption without compromising overall performance. Micron has also introduced HPM (High-Performance Mode), a proprietary feature that enhances performance during intensive smartphone usage, resulting in a 25% boost in speed when HPM is enabled.
Micron has already started shipping samples of the new UFS 4.0 storage in three capacities – 256 GB, 512 GB, and 1 TB.
