Qualcomm unveiled its latest ultra-low-power QCC730 Wi-Fi chip, promising enhanced range and data transfer speeds while consuming less energy and providing direct cloud connectivity. This dual-band micro-power Wi-Fi chip is targeted towards IoT devices, with Qualcomm emphasizing efficiency by claiming 88% less power consumption per data transfer compared to its previous iteration.
The new Wi-Fi chip also introduces direct cloud connectivity and integration with Matter, offering an open-source SDK and IDE along with cloud connectivity offloading through software stack. Positioned as a viable alternative to Bluetooth for IoT applications, it can operate in both hosted and hostless modes.
In addition to the QCC730, Qualcomm also introduced its RB3 Gen 2 robotics platform featuring on-device AI for enterprise and industrial solutions. This mid-tier offering in Qualcomm’s robotics platform boasts a QCS6490 CPU (8 cores, up to 2.7GHz), Adreno 643 GPU, support for multiple camera sensors, and an integrated Wi-Fi 6E chip, as well as Bluetooth 5.2 and LE audio.
Qualcomm is expanding the reach of the RB3 Gen 2 platform to various products including drones, cameras, and other industrial devices. Development kits include necessary accessories like power supply, speakers, USB cable, and a development board. Additionally, Qualcomm is offering Vision Kits with mounting brackets and Camera Serial Interface (CSI) cameras.
The RB3 Gen 2 from Qualcomm is slated for availability starting in June.
