Qualcomm’s most recent top-tier 5G modem focuses on combining ultra-fast 5G speeds with AI capabilities and broadening support for satellite connectivity. The X80 5G modem is Qualcomm’s seventh generation 5G modem designed for smartphones, XR devices, PCs, vehicles, and industrial IoT devices, featuring a dedicated AI processor.
The latest flagship Snapdragon modem from Qualcomm features a specialized 5G AI processor with a tensor accelerator that promises improved data speeds, coverage, power efficiency, and reduced latency. The onboard 5G AI Suite Gen 3 provides AI enhancements to assist with coverage and location accuracy. Qualcomm claims a 10% lower power consumption when connected to a mmWave network and a 30% improvement in location accuracy.
The Snapdragon X80 is the first 5G modem to offer fully integrated narrowband (NB) to non-terrestrial networks (NTN) satellite communications support. This development suggests that more high-end smartphones with satellite connectivity support will be released later this year.
The peak download speeds of the X80 are rated at 10 Gbps, while uploads are expected to reach a theoretical 3.5 Gbps with support for both 5G mmWave (10 carrier aggregation) and sub-6 GHz (5 carrier aggregation) frequencies. The X80 features a 6 receiver antenna architecture, is the first 5G modem with 6x downlink carrier aggregation, and incorporates AI-based mmWave range extension. Additionally, the X80 utilizes the same QTM565 mmWave antenna as the Snapdragon X75 modem.
Qualcomm is currently providing samples of the X80 5G modem to partner OEMs, with commercial devices expected to launch in the latter half of 2024.
Aside from the X80 5G modem, Qualcomm has also introduced its FastConnect 7900 mobile connectivity system – the first to integrate Wi-Fi, Bluetooth, and Ultra Wideband connectivity in a single 6nm chip. This system supports the latest Wi-Fi 7 standard with peak speeds of up to 5.8 Gbps and the Bluetooth 5.4 standard with spatial audio and ANT+ support.
The FastConnect 7900 module leverages AI enhancements for optimized latency and power consumption, adapting to specific scenarios and environments. Qualcomm claims up to 40% lower power usage compared to the previous FastConnect 7800 module.
Qualcomm also highlights proximity awareness capabilities with Wi-Fi ranging and Bluetooth channel sounding. The FastConnect 7900 supports XPAN and Snapdragon Seamless for connecting multiple devices with various operating systems, featuring intelligent audio switching and proximal device discovery.
This Wi-Fi chip supports the HBS standard for instant connectivity between devices and accessories with low latency.
Qualcomm’s FastConnect 7900 is expected to be commercially available in the second half of 2024.
